FR / Hight TG Electronic PCB Assembly With Green Solder Mask , 3mil Min. Line

Single-side,double-sided and multilayer PCB and PCB Assembly manufacturer/OEM

- Contract Manufacturing

- Mixed-technology (High speed SMT & Through hole assembly)

- PCB Design & Assembly and copy service

- Prototyping

- Components purchasing

- Metal box,Coil,Cable and Wire Assemblies

- Plastics and Molds

PCB Assembly Specifications
Quantity	Prototype and small to middle volume are our specialty
Type of Assembly	SMT and Thru-hole
Type of Service	Turn-Key, Partial Turn-Key or Consignment
Solder Type	Water Soluble Solder Paste, Leaded and Lead-Free
File Formats	Bill of Materials
Gerber Files
Pick-N-Place File (XYRS)
Bare Board Size	Smallest: 0.25 x 0.25 Inches
Largest: 20 x 20 Inches
Components	Passives Down to 0201 Size
BGA and VFBGA
Leadless Chip Carriers/ CSP
Double-Sided SMT Assembly
BGA Repair and Reball
Part Removal and Replacement
Component Packaging	Cut Tape,Tube,Reels,Loose Parts
Turn Time	Same Day Service to 15 day service
Testing	X-RAY Inspection & AOI Test

Application

Products are applied to a wide range of High-tech industries such as: LED lighting,telecommunication, computer application, lighting, game machine, industrial control, power,automobile and high-end consumer electronics, ect.

By unremitting work and effort to the marketing, products exports to American,Canada, Europe counties,Africa and other Asia-pacific countries.

PCB Assembly Technical Capability

We deliver high quality surface-mount technology (SMT) products through the use of modern, well maintained SMT lines that are operated by trained professionals. Our SMT lines are capable of handling both low and high volume through-put, can perform single and double sided component placement, mixture of SMT automatic and manual component assemblies, SMT and through-hole assemblies.

Capability   1.SMT with 4 million placements per day
                   2.Manual insertion with output 500,000pcs components per day
                   3.Chip mounting speed is 0.3S/unit,high-point speed is 0.16S/unit
                      

Mount Precision: 1.Chips size:Min.0201
                           2.Mounting precision:0.1mm
                           3.Multi-functional machine can match 0.3 pitch packages such as BGA,CSP

Quality Certificates