Delivery Time:Prototype 3 days, Mass Production 8 Days
Certification:ISO 9001:2008,ISO 14001:2004, UL, SGS, CTI
2.24hour quick turn
3.High Quality and best servise
4.no moq
Our Goal:To provide you with the best service and the best quality !
Detailed Specification of PCB And PCBA Manufacturing
|
Item |
Capability |
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1.Base Material |
FR-4 / High TG FR-4 / Lead free Materials (ROHS Compliant) / Halogen Free material /CEM-3/CEM-1/ /PTFE/ROGERS/ARLON/TACONIC |
|
2.Layers |
1-30 |
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3.Finised inner/outer copper thickness |
1-12OZ |
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4.Finished board thickness |
0.2-7.0mm |
|
Tolerance |
Board thickness≤1.0mm: 0.1mm 1<Board thickness≤2.0mm: 10% Board thickness>2.0mm: 8% |
|
5.Max panel size |
≤2sidesPCB: 600*1500mm Multilayer PCB: 500*1200mm |
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6.Min conductor line width/spacing |
Inner layers: ≥3/3mil Outer layers: ≥3.5/3.5mil |
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7.Min hole size |
Mechanical hole: 0.15mm Laser hole: 0.1mm |
|
Drilling precision: first drilling |
First drilling: 1mil Second drilling: 4mil |
|
8.Warpage |
Board thickness≤0.79mm: β≤1.0% 0.80≤Board thickness≤2.4mm: β≤0.7% Board thickness≥2.5mm: β≤0.5% |
|
9.Controlled Impedance |
5% |
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10. Aspect Ratio |
15:1 |
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11.Min welding ring |
4mil |
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12.Min solder mask bridge |
≥0.08mm |
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13.Plugging vias capability |
0.2-0.8mm |
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14. Hole tolerance |
PTH: 3mil NPTH: 2mil |
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15.Outline profile |
Rout/ V-cut/ Bridge/ Stamp hole |
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16.Surface treatment |
OSP: 0.5-0.5um HASL: 2-40um Lead free HASL: 2-40um ENIG: Au 1-10U’’ ENEPIG: PB 2-5U’’/ Au 1-8U’’ Immersion Tin:0.8-1.2um Immersion silver: 0.1-1.2um Peelable blue mask Carbon ink Gold plating: Au 1-150U’’ |
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17. E-testing pass percent |
97% pass for the first time,2%(tolerance) |
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FQC-Physical Lab: Reliability tests |
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18.Certificate |
ROHS UL ISO9001:2008 IPC SGS |
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19.Other technology capacity that we can according your design to changed. |
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Our equipments |
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1.Drillin |
