Product Details

Solder Mask Custom PCB Boards HASL Lead Free OSP Single Layer PCB

Brand Name SYF
Place of Origin China
Model Number SYF-273

Product Features

Delivery Time:6-8 DAYS
Certification:UL,ISO9001:2008,ROHS,REACH, HALOGEN FREE,SGS

 
Solder Mask Custom PCB Boards HASL ( Lead Free ) OSP Single Layer PCB

Quick Details

Certifications of ISO9001:2008,UL,CE,ROHS,REACH,HALOGEN-FREE is meet. Best service with quick response is always provided for our customers. All kinds of surface finish is accepted,such as ENIG,OSP.Immersion Silver,Immersion Tin,               Immersion Gold, Lead-free HASL,HAL. Advanced  production equipment imported from Japan and Germany,such as                                          PCB Lamination Machine, CNC drilling machine,Auto-PTH line,                                                               AOI(Automatic Optic Inspection),Probe Flying Machine and so on. BGA,Blind&Buried Vias and Impedence Control is accepted. Quality guarantee and professional after-sale service. Gerber file needed.

PRODUCT’S DETAILS

Raw Material

FR-4 (Tg 180 available)

Layer Count

4-Layer

Board Thickness

2.0mm

Copper Thickness

2.0oz

Surface Finish

ENIG(Electroless Nickel Immersion Gold)

Solder Mask

Green

Silkscreen

White

Min. Trace Width/Spacing

0.075/0.075mm

Min. Hole Size

0.25mm

Hole Wall Copper Thickness

≥20μm

Measurement

300×400mm

Packaging

Inner: Vacuum-packed in soft plastic bales 
Outer: Cardboard Cartons with double straps

Application

Communication,automobile,cell,computer,medical

Advantage

Competitive Price,Fast Delivery,OEM&ODM,Free Samples,

Special Requirements

Buried And Blind Via, Impedance Control, Via Plug, 
BGA Soldering And Gold Finger Are Acceptable

Certification

UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

PRODUCTION CAPABILITY OF PCB

 
PROCESS Engineer

ITEMS Item

         
 PRODUCTION CAPABILITY Manufacturing Capability

Laminate

Type

FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ,
ALUMINUM,CEM-1,CEM-3,TACONIC,ARLON,TEFLON

Thickness

0.2~3.2mm

Production Type

    Layer Count

2L-16L

Surface Treatment

 HAL,Gold Plating,Immersion Gold,OSP,
Immersion Silver,Immersion Tin,Lead Free HAL

 Cut Lamination

Max. Working Panel size

 1000×1200mm

 Inner Layer

 Internal Core Thickness

0.1~2.0mm

 Internal width/spacing

Min: 4/4mil

 Internal Copper Thickness

1.0~3.0oz

 Dimension

Board Thickness Tolerance

±10%

 Interlayer Alignment

±3mil

Drilling

 Manufacture Panel Size

Max: 650×560mm

 Drilling Diameter

≧0.25mm

 Hole Diameter Tolerance

±0.05mm

 Hole Position Tolerance

±0.076mm

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