Specifications
PCB/PCBA manufactureOEM/ODM service+100% test
UL,ROHS,CE,SGS
PCB lead time 20-25days
High quality,fast delivery
Product Technical Specification of Moko Technology Ltd | |||
Item | Parameter | ||
Double sided | Multilayer | ||
Number of Layers | 2 | 4~16 | |
Copper Thickness | 0.25~3.0OZ | 0.5~3.0OZ | |
Base Board Thickness | 0.3~3.2mm | 0.6~3.2mm | |
Incombustibility | 94V-0 | 94V-0 | |
Peelable resistance | 12.3N/cm | 12.3N/cm | |
Twist | ≤0.5% | ≤0.5% | |
Insulation resistance | ≥1011Ω | ≥1011Ω | |
Test voltage | 10-300V | 10-300V | |
Finished board area | 560×970mm | 560×970mm | |
Min. Line Width and Spacing | 0.1/0.1mm | 0.1/0.1mm | |
Copper thickness in hole | ≥25.0um | ≥25.0um | |
Mini. pad diameter | Inner layer |
| 0.05mm |
Out layer | 0.076mm | 0.076mm | |
Mini. Hole Diameter | 0.25mm | 0.20mm | |
Hole tolerance | PTH | ±0.076mm | ±0.076mm |
NPTH | ±0.05mm | ±0.05mm | |
Hole location tolerance | ±0.076mm | ±0.05mm | |
profile tolerance | Routing | ±0.1mm | ±0.1mm |
Punching | ±0.13mm | ±0.13mm | |
Solder mask bridge ability | ≥0.1mm | ≥0.075mm | |
Solder mask rigidity | 6H | 6H | |
Solderable test | 245 Degrees Centigrade 5 second | 245 Degrees Centigrade 5 second | |
Thermal cycling ability | 288 Degrees Centigrade 10 second | 288 Degrees Centigrade 10 second | |
Surface Finishing | OSP, HAL, Immersion gold , Gold plating, Rosin, Gold finger | OSP, HAL, Immersion gold , Gold plating, Rosin, Gold finger | |
· PCB board manufacture and PCBA service:
o PCB board file with parts list provided by customers
o PCB board made, circuit board parts purchased by us
o PCB board with parts assembled
o Electronic testing circuit board or PCBA
o Fast delivery, anti-static package
o RoHS Directive-compliant, lead-free
o One stop service for PCB design, PCB layout, PCB manufacture, components purchasing, PCB assembly, test, packing and PCB delivery
· Detailed terms for PCB assembly:
o Technical requirement:
§ Professional surface-mounting and through-hole soldering technology
§ Various sizes like 1206, 0805, 0603 components SMT technology
§ ICT (In Circuit Test), FCT (Functional Circuit Test) technology
§ PCB assembly with UL, CE, FCC, RoHS approval
§ Nitrogen gas reflow soldering technology for SMT
§ High standard SMT and solder assembly line
§ High density interconnected board placement technology capacity
o Quote requirement:
§ Gerber file and Bom list
§ Clear pics of pcba or pcba sample for us
Test method for PCBA
