DEUTEQ BOND 830
PCB Bonding Promoter
Introduction
1. For the production of multi-players in horizontal application, replace black oxide process, environment friendly.
2. For inner layers with extreme high copper loading (up to 50g/L).
3. Create a red-brown colored, micro-etched copper surface, which is optimized for reliable adhesion between dielectric and copper layers.
4. No pink ring.
Operating Conditions
DEUTEQ BOND 830 94L
Hydrogen Peroxide 6L
Temperature 30-35 °C
Time 40-50 sec
* Note: For horizontal flood immersion line.
