Specifications
Alumina Plate/Alumina Ceramic Substratehigh compressive strength
use temperature up to 2400 degree
wear resistance
Alumina Plate/Alumina Ceramic Substrate
For this plate/board,mainly the alumina content is 75-99%.It has the features of high reliability,high density power,high thermal conductivity,high insulation and cycling performance.Dimensions can be formed be mould stamping or laser cutting, it is used in thick film circuit,large-scale integrated circuit,hybrid IC,semiconductor package,chip resistor and other electronic industry fields.
Metallization: Could coat with Copper/Gold/W+Mn Etc.and DBC customized designs!
Alumina Plate/Alumina Ceramic Substrate Technique Datas:
Alumina Plate/Alumina Ceramic Substrate Photos:
Any question, pls feel free to contact Joanna:
Tel.: +86-731-23181339
Fax: +86-731-23181337
Phone: +86-15869740474
Mail: export5 @ fqspecialceramic.com.cn
MSN: fqporcelain @ hotmail.com
Website: www.ur-brand.net www.ur-brand.net www.ur-brand.net www.fq-porcelain.com