Product Details

Gas Heated Wafer Baking Line type:27-75 Plates

Condition New
Place of Origin Guangdong, China
Brand Name KEHUA wafer production line
Model Number KHG wafer production line
Usage Biscuit
Type Other, Wafer Baking Oven, wafer production line
Power Source Other, gas or electrical
Voltage 380V
Power(W) 5.52kw to 8.12kw
Weight 13tons to 25tons
Dimension(L*W*H) 17.9m*1.8m*2.6m
Certification CE, ISO9001:2000, FM
Warranty One year, One year
After-sales Service Provided Engineers available to service machinery overseas

Product Features

Wafer Production Line

 

Gas wafer baking production line(27-75 models)

 

Description:

 

1. Brand: KEHUA Brand (famous foodstuff machinery brand in China)

2. Function: produce the different kinds of wafer automatically.

3. Capacity: 2.18 tons to 6.84tons/per hour.

4. Manufacture experiences: 15 years.

5. Baking type:  a) Gas (LNG or LPG);  

6. Whole shell of line use N304 stainless stell in accordance with health and safety standard.

7. Electricity and transmission all made by  Siemens, Mitsubishi. 

8. Bearing brand: SKF Franch/Austria

9. Motor brand: SEW Germany

 

After sales service:

 

1. Warranty period: one year.

2. Installation: we will send our trained specialists to install the machines and train the customer's worker when the equipments are arrived in the client's city.

3. If the machines have something wrong, we will help you to solve the problem anytime. 

 

Technical Data:

 

Models

27

33

39

45

51

65

69

75

Baking Oven Length(mm)

6000

7150

8300

9450

10600

13300

14000

16000

Whole Line Length(mm)

22000

23150

24300

25450

26600

29300

30000

35400

Power (Kw)

5.52

5.52

5.52

5.52

5.52

8.12

8.12

8.12

Consumption LNG(m3/h)

21

26

30

35

40

50

54

58

Capacity(pcs/min)

14

17

20

23

26

33

35

38

Parameter: 
1) The standard size of the baking plate is 470*325mm;  Pattern(standard) is 2.5*2.5*0.5mm;
2) The size of wafer sheet is 464*321mm; The effective cutting size of wafer sheet is 456*315mm;  
3) Wafer sheet's thickness: 2.5mm---3.2mm;
4) Weight of wafer sheet: 50---60g;


Drawing of wafer biscuit machine:  

27-33 models:

Gas Heated Wafer Baking Line type:27-75 Plates

39-51 models:

Gas Heated Wafer Baking Line type:27-75 Plates

65-69 models:

Gas Heated Wafer Baking Line type:27-75 Plates

75 models:

 Gas Heated Wafer Baking Line type:27-75 Plates

 

Machinery’s pictures:

Gas Heated Wafer Baking Line type:27-75 Plates

 

Wafer biscuits pictures:

Gas Heated Wafer Baking Line type:27-75 PlatesGas Heated Wafer Baking Line type:27-75 Plates

 

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