Product Description
DB3050 is a two-component, low viscosity, room temperature curing modified epoxy resin adhesive-forms suitable adhesives between many different types of materials. The product has excellent temperature resistance and high storage stability. Typical application This product is suitable for normal temperature curing process, mainly used for potting of hydrogen energy fuel cell humidifiers, bonding, and reinforcing various substrates such as LCP and metal structure.
Typical use
For fuel cell system humidifier sealing applications
Material properties before curing
Item | Component A | Component B |
Chemical type | Modified epoxy resin | |
Appearance | pale yellow | transparent |
Proportion@25℃ ASTM D1875 g/cm3 | 1.09-1.19 | 0.89-0.99 |
Viscosity @25℃ ASTM D2196 mpa.s | 11200-16800 | 6.4-9.6 |
Storage period@-5℃ month | 12 | |
Physical properties of cured material
Item | Typical |
Shear strength，ASTM D1002 MPa | ≥10 |
HardnessA ASTM D2240 | 77～83 |
Water absorption， GBT 1034-2008 wt% Soak in room temperature distilled water for 24 hours | 0.1%-0.2% |
Curing Exotherm °C Temperature Gun | ≦70 |
Operating temperature ℃ | -40～120 |
