Easy Application 0.203mm thickness high adhesive 0.9W thermal conductive bonding tapes TIA 808
The TIA™808 Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.
Features
Thermal Conductivity: 0.9 W/mK
High bond strength to a variety of surfaces double sided pressure sensitive adhesive tape
High performance, thermally conductive acrylic adhesive
Applications
Mount heat sink onto BGA graphic processor or drive processor
Mount heat spreader onto power converter PCB or onto motor control PCB
High performance, thermally conductive acrylic adhesive
Can be used instead of heat cure adhesive,screw mounting or clip mounting
