Diamond Slurry for Lapping Silicon Carbide
1. Application fieldsThis product is mainly used for coarse grinding and thinning of silicon carbide wafers.
2. Product SpecificationsProduct Type | Particle Size | Abrasive Type | Density/Properties |
DPI-SiC | D50=2-4μm | Mono diamond | Stable suspension, water-based carrier |
Special requirements can be tailor-made.
3. Product characteristics(1)The product is matched with cast iron plate to achieve high material removal rate meanwhile ensure the quality of silicon carbide wafer (Warp, bow, TTV);
(2)The product has good anti-rust performance;
(3)The product possesses stable suspension of diamond abrasives, and there is no obvious settlement phenomenon when placed for a long time;
(4)Strict quality control to ensure the consistency and stability of product quality.
Diamond slurry for lapping and polishing 1. Application fieldsThis product is mainly used for lapping and polishing of silicon carbide wafers.
2. Product SpecificationsProduct Type | Size specification | Abrasive Type | Characteristic |
DPP-SiC | D50=2-4μm | Poly/polycrystalline-like diamond | Stable suspension, water-based carrier |
D50=0-1μm | Poly/polycrystalline-like diamond | Stable suspension, water-based carrier | |
D50=0.2μm | Polycrystalline-like diamond | Stable suspension, water-based carrier |
Special requirements can be tailor-made.
3. Product characteristics(1)The product is matched with a special silicon carbide Lapping pad to achieve high removal rate and improve efficiency;
(2)High surface quality of the silicon carbide wafer after lapping processing (roughness, scratch, sub-surface damage layer and other parameters);
(3)Water-soluble carrier formula with good cleaning performance;
(4)Stable suspension;
(5)Compared with conventional water-based formula, the product has better lubrication performance.
