Wafer wafers need to be toasted in some special processes. At this time, a silicon wafer high temperature resistant material box for metal storage is required, and then placed in an oven for toasting. . At present, the most widely used in the semiconductor packaging and testing industry is the aluminum alloy processing surface for hard oxidation treatment, which can withstand 300 degrees of high temperature without discoloration and deformation.
Wafer silicon high temperature Wafer Frame Cassette
Model Number | DSF20B05-000-R0 |
Size | 143*145*142.6 mm |
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